Malaysia and Netherlands Sign Semiconductor Cooperation Agreement to Strengthen Global Chip Industry

The Hague, The Gulf Observer: Malaysia and the Netherlands have formalized a new cooperation agreement aimed at bolstering collaboration in the semiconductor industry, reinforcing Malaysia’s role as a global hub for chip assembly and testing, while supporting the Netherlands’ position in advanced manufacturing and innovation.

The Memorandum of Cooperation (MoC) was signed in The Hague by Malaysia’s Minister of Investment, Trade and Industry, Tengku Datuk Seri Zafrul Aziz, and Dutch Minister of Economic Affairs, Vincent Karremans. The initiative stems from discussions first proposed by the prime ministers of both countries during the Dutch leader’s visit to Kuala Lumpur in 2023.

Under the agreement, Malaysia and the Netherlands will establish an annual Malaysia–Netherlands Semiconductor Dialogue to review joint projects, share policy and market updates, and coordinate initiatives in skills development, research, and technology exchange.

Speaking at the signing, Tengku Zafrul emphasized that the partnership reflects a shared commitment to enhancing Malaysia’s assembly, testing, and packaging capabilities while advancing up the value chain through Dutch expertise in high-end chip manufacturing.

“By combining our unique strengths, we are confident this collaboration will enhance global supply chain security and create new opportunities for innovation and growth in the global semiconductor industry. Through structured dialogue and joint initiatives, we aspire to build a resilient, future-proof semiconductor ecosystem that benefits both our nations and the global economy,” he said.

The agreement is expected to deepen bilateral cooperation, foster innovation, and contribute to strengthening the resilience of the global semiconductor supply chain.